PACK EXPO International showcases innovation in action
As consumer demands for convenience, flexibility and personalization grow, the packaging industry continues to design solutions to meet these expectations.
Big data analytics, the Industrial Internet of Things (IIoT), artificial intelligence, machine learning, digitization and the cloud cause manufacturers to consider the disruptive potential these new technologies can have on their market and processes. And, as consumer demands for convenience, flexibility and personalization grow, the packaging industry continues to design solutions to meet these expectations. That’s why PACK EXPO International is poised to showcase innovation in action at this year’s tradeshow, scheduled for Oct. 14-17 at Chicago’s McCormick Place.
Produced by PMMI, The Association of Packaging and Processing Technologies, Reston, Va., PACK EXPO International 2018 is co-located with the Healthcare Packaging EXPO, and is expected to host 2,500 suppliers and 50,000 attendees from more than 125 countries in over 1.2 million net square feet of exhibit space.