From Big data analytics, the Industrial Internet of Things (IIoT) and artificial intelligence to machine learning, digitization and the cloud-based solutions, PACK EXPO International showcased innovation in action at this year’s tradeshow, Oct. 14-17 at Chicago’s McCormick Place.
Produced by PMMI, The Association of Packaging and Processing Technologies, Reston, Va., PACK EXPO International co-located with the Healthcare Packaging EXPO to host 2,500 suppliers and 50,000 attendees from more than 125 countries in over 1.2 million net square feet of exhibit space.