PACK EXPO International showcases innovation in action
As consumer demands for convenience, flexibility and personalization grow, the packaging industry continues to design solutions to meet these expectations.
Big data analytics, the Industrial Internet of Things (IIoT), artificial intelligence, machine learning, digitization and the cloud cause manufacturers to consider the disruptive potential these new technologies can have on their market and processes. And, as consumer demands for convenience, flexibility and personalization grow, the packaging industry continues to design solutions to meet these expectations. That’s why PACK EXPO International is poised to showcase innovation in action at this year’s tradeshow, scheduled for Oct. 14-17 at Chicago’s McCormick Place.
Produced by PMMI, The Association of Packaging and Processing Technologies, Reston, Va., PACK EXPO International 2018 is co-located with the Healthcare Packaging EXPO, and is expected to host 2,500 suppliers and 50,000 attendees from more than 125 countries in over 1.2 million net square feet of exhibit space.
This year’s show debuts the PACKage Printing Pavilion, the industry’s main stage for package printing innovations. This 50,000-square-foot area focuses on the advantages of digital printing, geared toward short-run, on-demand, cost-effective, variable data and personalized packaging.
In addition to exploring state-of-the-art packaging technologies, equipment and materials, top consumer packaged goods companies from around the world come to PACK EXPO International to exchange ideas with peers and build professional relationships. Beyond the technologies exhibited on the show floor, attendees will find educational opportunities at the Innovation Stage, where suppliers present free 30-minute seminars on breakthrough technologies. Coming off its debut at PACK EXPO East 2018, The Forum at PACK EXPO provides attendees an interactive learning experience, with sessions on the latest industry trends followed by small group discussions and Q&A meetings.
Back by popular demand are the The Candy Bar Lounge, The Beverage Cooler Lounge and The Snack Break Lounge. Hosted by The National Confectioners Association, Washington, D.C., and sponsored by Robert Bosch Confectionary Technology GmbH, Germany, The Candy Bar Lounge will serve as a networking destination for confectionery industry experts and their customers. The International Society of Beverage Technologists (ISBT), Dallas, Texas, will host The Beverage Cooler Lounge, sponsored by Bevcorp, LLC, Willouby, Colo., serving as a networking hub for beverage industry professionals and ISBT subject matter experts. And, the Snack Break Lounge, hosted for the first time by SNAC International, Arlington, Va., and co-sponsored by Dorner Manufacturing Corp., Hartland, Wis.; JLS Automation, York, Pa.; and Soft Robotics, Inc., Cambridge, Mass., will serve as the central meeting place and information center for snack industry professionals.
For more information, go to www.packexpointernational.com. And, swing by Refrigerated & Frozen Foods’ booth, No. E-10034.